PCB Assembly Services
Compliant with IATF, ISO, IPC and UL standards. 99.9% product pass rate including online SPI, AOI and X-Ray.
Rigid-flex to rigid-flex PCB assembly uses leaded and lead-free solder.
We have 10 SMT mounting lines and 6 DIP/finished product assembly lines.
It will be shipped in 4 to 48 hours after board mounting is completed.
We have reliable parts suppliers.
We provide 24/7 live sales and technical support.
Our PCB Assembly Service
Our PCB Assembly Service List
We Provide the Best Surface-mount technology services Worldwide
FPGA BGA assembly patch manufacturer
Industrial control SMT chip processing
Automotive Lighting LED PCB Assembly
Camera Module Rigid-Flex PCB Assembly
Security Equipment Turnkey PCB Assembly
Communication equipment PCB assembly
KF: Your reliable PCB manufacturing supplier in China
China PCB Fabrication&PCBA Assembly Manufacturer-KF PCB Assembly Factory, Sourcing of parts+Lead-Free Crest + Post-Weld + Check.One-StopPCB Assembly Services. High Precision Manufacturing Facility. SMT Capacity: 19 Million Points/Day, Monthly Production Capacity Can Reach 150,000 to 300,000 Sets/Month.
Why us?
● Keep your information safety
We can sign NDA and make sure your personal information only used for orders.
● No minimum requirement
No MOQ requested. You may order as 1~10pcs from us. We do not force you to buy what you do not need indeed to save your expenses.
● Quick turnaround time
24 Hours customer service, Kitted and Turn-Key options available.
● Advanced equipment
7 automated lines to handle SMT, through-hole, high-mix technology.
● Competitive price
Free samples provided, Reliable components sourcing channel.
● Delivery guarantee
99% On-Time Delivery, time is money we guarantee ensures you get what you need, when you need it.
● High quality
Fully Compliant with IPC 610-D Standards, Testing and quality assurance.
● PCB Assembly specialists
From prototypes to full production runs.
● All-in-one
PCB Fabrication, parts sourcing and PCB assembly.
PCB Assembly Capability
| SMT capacity: 19 million points/day | |
|---|---|
| Testing Equipment | X-RAY Nondestructive Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station |
| Placement speed | Chip placement speed (at best conditions) 0.036 S/piece |
| Mounted Component Specifications | Pasteable smallest package |
| Minimum device accuracy | |
| IC type chip accuracy | |
| Mounted PCB Specifications | Substrate size |
| Substrate thickness | |
| throw rate | Resistance-capacitance ratio 0.3% |
| IC type without throwing material | |
| Board Type | POP/common board/FPC/rigid-flex board/metal substrate |
| DIP daily production capacity | |
|---|---|
| DIP plug-in production line | 50000 points/day |
| DIP post welding production line | 20000 points/day |
| DIP test production line | 50000pcs PCBA/day |
| Assembly processing capability | |
|---|---|
| The company has more than 10 advanced assembly production lines, dust-free and anti-static air-conditioning workshop, TP dust-free workshop, equipped with aging room, test room, functional test isolation room, advanced and perfect equipment, can carry out various product assembly, packaging, testing, Aging, etc. production. Monthly production capacity can reach 150,000 to 300,000 sets/month | |
| PCBA processing capability | ||
|---|---|---|
| project | Mass processing capability | Small batch processing capability |
| Number of layers (max) | 2-18 | 20-30 |
| Plate type | FR-4, Ceramic Sheet, Aluminum Base Sheet PTFE, Halogen Free Sheet, High Tg Sheet | PTFE, PPO, PPE |
| Rogers,etc Teflon | E-65, ect | |
| Sheet mixing | 4 layers - 6 layers | 6th floor - 8th floor |
| biggest size | 610mm X 1100mm | / |
| Dimensional Accuracy | ±0.13mm | ±0.10mm |
| Plate thickness range | 0.2mm--6.00mm | 0.2mm--8.00mm |
| Thickness tolerance ( t≥0.8mm) | ±8% | ±5% |
| Thickness tolerance (t＜0.8mm) | ±10% | ±8% |
| Media thickness | 0.076mm--6.00mm | 0.076mm--0.100mm |
| Minimum line width | 0.10mm | 0.075mm |
| Minimum spacing | 0.10mm | 0.075mm |
| Outer copper thickness | 8.75um--175um | 8.75um--280um |
| Inner layer copper thickness | 17.5um--175um | 0.15mm--0.25mm |
| Drilling hole diameter (mechanical drill) | 0.25mm--6.00mm | 0.15mm--0.25mm |
| Hole diameter (mechanical drill) | 0.20mm--6.00mm | 0.10mm--0.20mm |
| Hole Tolerance (Mechanical Drill) | 0.075mm | 0.050mm |
| Laser Drilling Aperture | 0.10mm | 0.075mm |
| Plate thickness aperture ratio | 10：1 | 12：1 |
| Solder mask type | Photosensitive green, yellow, black, purple, blue, ink | / |
| Minimum Solder Mask Bridge Width | 0.10mm | 0.075mm |
| Minimum Solder Mask Isolation Ring | 0.05mm | 0.025mm |
| Plug hole diameter | 0.25mm--0.60mm | 0.60mm-0.80mm |
| Impedance tolerance | ±10% | ±5% |
| Surface treatment type | Hot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card board | Immersion Tin, OSP |
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