Data Sheet
Name: RoHS Custom Quick Turn PCB Assembly(SMT chip processing)
PCBType: Rigid Circuit Board
Dielectric: FR-4Material: Fiberglass Epoxy
Application: Consumer Electronics
Flame Retardant Properties: V0
Mechanical Rigid: Rigid
Processing Technology: Electrolytic Foil
Base Material: Copper
Insulation Materials: Organic Resin
Quality Grade: Ipc Class 2, Ipc Class 3
Brand Of Laminate: Kingboard, Iteq, Shengyi, Nanya, Isola, Rogers
PCB Layers: 1~30 Layer
Board Thickness: 0.1~8.0mmBoard Thickness
Tolerance: ±0.1mm / ±10%
Surface Finishes: OSP, HASL, HASL Lf, Immersion Gold, Etc.
Solder Mask Colors: Green, Red, White, Black, Blue, Yellow, Orange
Silkscreen Colors: Black, White, Yellow, Etc.
Electrical Testing: Fixture / Flying ProbeOther
Testing: Aoi, X-ray(Au&Ni), Controlled Impedance Test
Product Details
The standard ClearONE terminator is the industry leader in performance and reliability. The need to provide a lead free solution for resistor terminator networks in compliance with the RoHS initiative has required CTS to add a new material set to the ClearONE product line.
Many manufacturers have chosen to utilize Tin/Silver/Copper (Sn/Ag/Cu or SAC) spheres in their BGA products as a means of eliminating lead. The SAC spheres collapse into the interface solder during the reflow process, providing an unwanted and less than desirable variation in performance.
This new RoHS ClearONE material set takes advantage of the existing designs while eliminating leadbearing solders. ClearONE solder spheres (10/90 Tin/Lead) and the eutectic interface solder (63/37 Tin/Lead) are replaced with Tin/Nickel-plated copper spheres and high temperature Tin/Silver/Copper (Sn/3.5Ag/0.5Cu) interface solder for the RoHS ClearONE terminators. As with the 10/90 spheres, the copper spheres do not collapse during solder reflow. By utilizing spheres that do not collapse, the RoHS ClearONE terminators maintain a predictable, consistent standoff height, and the performance established in the previous non-RoHS product.
The standard ClearONE Ball Grid Array (BGA) terminator material set is described in Figure 1. The ClearONE product designs provide identical performance in each channel through the use of symmetrical element layouts and by maintaining predictable standoff spacing.
Figure 1. ClearONE terminator with lead bearing material set
The RoHS Compliant ClearONE terminators continue to take advantage of the symmetrical layout designs and predictable standoff spacing by utilizing copper spheres that maintain their shape, as shown in Figure 2.
Figure 2. ClearONE Terminator with RoHS compliant material set
PCB Land Pad Design
The shape of the CBGA land pads on the PCB should be round. The diameters of the PCB land pads are recommended to be equal to the nominal CBGA solder ball diameter as provided on the product data sheets, see Figure 3. Tolerance for the CBGA land pad diameter is + 0.001 inches (+0.025mm). The absolute minimum land pad diameter shall be 0.020” and 0.025” for 1.0mm and 1.27mm pitch parts respectively.
Figure 3. CBGA Solder Ball and PCB Land Pads are equal size
The solder mask surrounding the land pad should not overlap the land pad to ensure maximum thermal cycling reliability, see Figure 3.
The electrical trace leading into the CBGA land pads requires a minimum width trace per the PCB board manufacturing technology used.
CBGA land pads are not to be located on top of any vias.
Vias connected to the CBGA land pads, should have a minimum width connecting trace, with a minimum length of 0.010 inches (0.254 mm), see Figure.
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