Copper substrate

Generally, there are immersion gold copper substrates, silver-plated copper substrates, tin-sprayed copper substrates, and anti-oxidation copper substrates. The circuit layer of the copper substrate is required to have a large current carrying capacity, so thicker copper foil should be used, with a thickness of generally 35μm~280μm; the thermal insulation layer is the core technology of the copper substrate, and the core thermal conductive components are Al2O3 and silicon powder The composition is composed of epoxy resin filled polymers, with low thermal resistance (0.15), excellent viscoelastic properties, thermal aging resistance, and ability to withstand mechanical and thermal stress. The metal base layer of the copper substrate is the supporting member of the copper substrate, which requires high thermal conductivity, usually a copper plate, but a copper plate can also be used (the copper plate can provide better thermal conductivity).